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AMAOE U-IP 10 BGA Reballing Stencil for iPhone 14 Series – A16 / A15 CPU | 0.12mm
AMAOE U-IP 10 BGA Reballing Stencil for iPhone 14 Series – A16 / A15 CPU | 0.12mm
Regular price
$1.38 USD
Regular price
$2.16 USD
Sale price
$1.38 USD
Shipping calculated at checkout.
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The AMAOE U-IP 10 is a precision-engineered 0.12mm BGA reballing stencil built for iPhone 14, 14 Plus, 14 Pro, and 14 Pro Max CPU chip repair. It covers both the Apple A16 Bionic and A15 Bionic chipsets, giving your workshop complete coverage for the entire iPhone 14 lineup. Designed by AMAOE with tight ball placement accuracy, this stencil delivers clean, consistent solder ball deposits every time — making it the go-to choice for technicians handling IC change karna on Apple flagship boards.
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